Thank you for taking an interest in our selection of 5962-01-199-8967 parts here on Boost AOG. You are currently on the RFQ form for part number X2212DMB 10, a Xicor Inc product listed with the Microcircuit Memory If part number X2212DMB 10 catches your eye, be sure to use our online RFQ service to request quotes, with customized responses provided within 15 minutes of us receiving and reviewing a completed submission.
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To ensure the quality of our NSN components, we adhere to a strict NO CHINA SOURCING pledge, meaning every purchased item will be delivered alongside any pertinent qualifying certifications or manufacturing trace documentation for your benefit. Paired with numerous other commitments, we proudly operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. If you happen to be facing a time constraint and require NSN parts quickly, contact us at your earliest convenience, and we will discuss the expedited shipping options we have available for domestic and international customers alike. With our various dedications in mind, kick off procurement for Xicor Inc part number X2212DMB 10 and other Microcircuit Memory products today.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-199-8967 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 011998967 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| X2212D | 3 | 1 | C | A |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND HIGH VOLTAGE AND STATIC OPERATION |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.0 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
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