Thank you for taking an interest in our selection of 5962-01-408-5951 parts here on Boost AOG. You are currently on the RFQ form for part number IDT54FCT533ALB, a Integrated Device Technology Inc product listed with the Microcircuit Digital If part number IDT54FCT533ALB catches your eye, be sure to use our online RFQ service to request quotes, with customized responses provided within 15 minutes of us receiving and reviewing a completed submission.
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| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-408-5951 Item PartTypeName: MICROCIRCUIT,DIGITAL | 5962 | 014085951 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| IDT54FCT533ALB | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.358 INCHES NOMINAL" |
| ADAT | BODY WIDTH | 0.358 INCHES NOMINAL" |
| ADAU | BODY HEIGHT | 0.100 INCHES NOMINAL" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CSSL | DESIGN FUNCTION AND QUANTITY | 8 LATCH" |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 6.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, DIGITAL, FAST, CMOS, OCTAL TRANSPARENT LATCHES, MONOLITHIC SILICON" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS" |
| ADAQ | BODY LENGTH | 0.358 INCHES NOMINAL" |
| ADAT | BODY WIDTH | 0.358 INCHES NOMINAL" |
| ADAU | BODY HEIGHT | 0.100 INCHES NOMINAL" |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CSSL | DESIGN FUNCTION AND QUANTITY | 8 LATCH" |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 6.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, DIGITAL, FAST, CMOS, OCTAL TRANSPARENT LATCHES, MONOLITHIC SILICON" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS" |
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