Thank you for taking an interest in our selection of 5962-01-576-5546 parts here on Boost AOG. You are currently on the RFQ form for part number HMC241QS16, a Hittite Microwave Corporation product listed with the Microcircuit Linear If part number HMC241QS16 catches your eye, be sure to use our online RFQ service to request quotes, with customized responses provided within 15 minutes of us receiving and reviewing a completed submission.
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To ensure the quality of our NSN components, we adhere to a strict NO CHINA SOURCING pledge, meaning every purchased item will be delivered alongside any pertinent qualifying certifications or manufacturing trace documentation for your benefit. Paired with numerous other commitments, we proudly operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. If you happen to be facing a time constraint and require NSN parts quickly, contact us at your earliest convenience, and we will discuss the expedited shipping options we have available for domestic and international customers alike. With our various dedications in mind, kick off procurement for Hittite Microwave Corporation part number HMC241QS16 and other Microcircuit Linear products today.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-576-5546 Item PartTypeName: MICROCIRCUIT,LINEAR | 5962 | 015765546 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
91793093 | 5 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
CXCY | Part Name Assigned By Controlling Agency | GAAS MMIC SP4T NON-REFLECTIVE SWITCH, DC-3.5 GHZ |
FEAT | Special Features | PACKAGE BODY MATERIAL, LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED; LEADFRAME PLATING, SN PB SOLDER; MSL RATING, MSL1 (1); STORAGE TEMPERATURE, -65 TO POSITIVE 150 DEGREES C; OPERATING TEMPERATURE, -40 TO POSITIVE 85 DEGREES C; NOTES, LEADFRAME MATERIAL-COPPER ALLOY; DIMENSIONS ARE IN INCHES (MILLIMETERS); DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15MM PER SIDE; DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25MM PER SIDE; ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND |
MRC | Decoded Requirement | Clear Text Reply |
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