DPS256X32V3-85B of Dpac Technologies Corp under NSN 5962-01-394-7210

Part Number: DPS256X32V3-85B

Alternate P/N: DPS256X32V385B

Manufacturer: Dpac Technologies Corp

NSN: 5962-01-394-7210

NIIN: 013947210

Item Name : Microcircuit Memory

CAGE Code: 66847

FSC: 5962 Microcircuits Electronic

FSG: 59 Electrical and Electronic Equipment Components

Country: USA

NCB Code: 01

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To ensure the quality of our NSN components, we adhere to a strict NO CHINA SOURCING pledge, meaning every purchased item will be delivered alongside any pertinent qualifying certifications or manufacturing trace documentation for your benefit. Paired with numerous other commitments, we proudly operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. If you happen to be facing a time constraint and require NSN parts quickly, contact us at your earliest convenience, and we will discuss the expedited shipping options we have available for domestic and international customers alike. With our various dedications in mind, kick off procurement for Dpac Technologies Corp part number DPS256X32V3-85B and other Microcircuit Memory products today.

NSN Information for Part Number DPS256X32V3-85B with NSN 5962-01-394-7210, 5962013947210

NSN	FSC	NIIN	CLS	Hazmat	DEMIL	Cancelled NSN
5962-01-394-7210 Item PartTypeName: MICROCIRCUIT,MEMORY	5962	013947210	0	N	D
	CIIC	HCC	ESD	PMIC	Criticality	ENAC
	U		D	A	0
Part Number	ISC	RNVC	RNCC	HCC	MSDS	SADC
DPS256X32V3-85B	5	9	5

Characteristics Data of NSN 5962-01-394-7210, 5962013947210

MRC	Criteria	Characteristic
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE
AFJQ	STORAGE TEMP RANGE	-65.0 TO 150.0 DEG CELSIUS
CWSG	TERMINAL SURFACE TREATMENT	SOLDER
TTQY	TERMINAL TYPE AND QUANTITY	66 PIN
AFGA	OPERATING TEMP RANGE	-55.0 TO 125.0 DEG CELSIUS
CBBL	FEATURES PROVIDED	ELECTROSTATIC SENSITIVE
CQSJ	INCLOSURE MATERIAL	CERAMIC
CXCY	PART NAME ASSIGNED BY CONTROLLING AGENCY	MICROCIRCUIT,MEMORY,8 MEGABITSRAM MODULE
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT
CZER	MEMORY DEVICE TYPE	RAM
CZES	HYBRID TECHNOLOGY TYPE	MULTICHIP