| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-355-3768 (013553768) |
| NCB Code | USA (01) |
| Manufacturer | Nimikkeistokeskus Ncb Finland, Atmel Corporation, Hydro Aire Inc, Dla Land And Maritime, Seeq Technology Inc, Raytheon Company, Lockheed Martin Corporation, Xicor Inc |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 10133797 | nimikkeistokeskus ncb finland | microcircuit memory | a486g | RFQ |
| 28C256-20DM 883 | atmel corporation | microcircuit memory | 1fn41 | RFQ |
| 42-799505 | hydro aire inc | microcircuit memory | 81982 | RFQ |
| 5962-88525 | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8852504XA | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8852504XB | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8852504XX | dla land and maritime | microcircuit memory | 67268 | RFQ |
| DM28C256-200 B | seeq technology inc | microcircuit memory | 61394 | RFQ |
| G490119-1 | raytheon company | microcircuit memory | 49956 | RFQ |
| PL7145598-01 | lockheed martin corporation | microcircuit memory | 90536 | RFQ |
| ROM PROM HEAD 269 | dla land and maritime | microcircuit memory | 16236 | RFQ |
| X28C256DMB-20 | xicor inc | microcircuit memory | 60395 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 80.00 MILLIAMPERES NOMINAL TOTAL SUPPLY |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 6.25 VOLTS MAXIMUM POWER SOURCE |
| ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| CBBL | FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED AND BIPOLAR |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 23 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM ACCESS |
| CZER | MEMORY DEVICE TYPE | EEPROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| Relevant Components for NSN - 5962-01-355-3768, 5962013553768 | ||||
| 5910-00-519-6659 (5910005196659) | 5998-00-402-3992 (5998004023992) | 5950-00-645-9586 (5950006459586) | 5998-01-269-0954 (5998012690954) | |
| 5962-01-336-4927 (5962013364927) | 5930-01-269-5071 (5930012695071) | 5995-01-541-0231 (5995015410231) | 5995-01-312-8234 (5995013128234) | |
| 5955-00-080-1106 (5955000801106) | 5915-01-112-7236 (5915011127236) | 5930-00-583-6117 (5930005836117) | 5930-01-287-3729 (5930012873729) | |
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