If you are looking for NSN 5962-01-333-2528 supplies, turn to Boost AOG and our vast collection of offerings. On this page, we have arranged our NSN 5962-01-333-2528 inventory, where part numbers like 10129514, 27C512 20MR K, 5962-87648, 5962-8764802BYA, 5962-8764802BYB, and others are presented alongside relevant information about this NSN for your perusal. Take the time to browse our ever-expanding selection of components as you see fit, and if any particular items pique your interest, be sure to use our online RFQ service to request quotes for your consideration.
All manufacturers and suppliers whose parts we sell are carefully evaluated by our staff as necessary, and a myriad of products we carry are subjected to diverse levels of testing and inspection for fit, form, and function. Additionally, we are fully committed to addressing the time limitations of our customers who shop on Boost AOG, providing options for accelerated shipping based on availability. Keeping this in mind, do not hesitate to reach out to us directly by phone or email, and our knowledgeable team members would be more than happy to help you obtain the NSN 5962-01-333-2528 parts you desire.
| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-333-2528 (013332528) |
| NCB Code | USA (01) |
| Manufacturer | Nimikkeistokeskus Ncb Finland, Microchip Technology Incorporated, Dla Land And Maritime, Lockheed Martin Corporation, Advanced Micro Devices Inc, Austin Semiconductor Inc, Atmel Corporation, Texas Instruments Inc, Waferscale Integration Inc |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 10129514 | nimikkeistokeskus ncb finland | microcircuit memory | a486g | RFQ |
| 27C512 20MR K | microchip technology incorporated | microcircuit memory | 60991 | RFQ |
| 5962-87648 | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8764802BYA | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8764802BYB | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8764802BYX | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8764802YA | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8764802YB | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8764802YX | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 77A110867P001 | lockheed martin corporation | microcircuit memory | 03538 | RFQ |
| AM27C512-200 BUA | advanced micro devices inc | microcircuit memory | 34335 | RFQ |
| AS57C512-20ECM | austin semiconductor inc | microcircuit memory | 0eu86 | RFQ |
| AT27C512 20LM 88 | atmel corporation | microcircuit memory | 1fn41 | RFQ |
| AT27C512R-20LM 883 | atmel corporation | microcircuit memory | 1fn41 | RFQ |
| SL127 | atmel corporation | microcircuit memory | 1fn41 | RFQ |
| SMJ27C512-FM | texas instruments inc | microcircuit memory | 01295 | RFQ |
| WS27C512L-20CMB | waferscale integration inc | microcircuit memory | 66579 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| AEHX | MAXIMUM POWER DISSIPATION RATING | 350.0 MILLIWATTS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 60.00 MILLIAMPERES MAXIMUM SUPPLY |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | EPROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| Relevant Components for NSN - 5962-01-333-2528, 5962013332528 | ||||
| 5935-01-264-3240 (5935012643240) | 5910-01-115-9700 (5910011159700) | 5962-00-001-1902 (5962000011902) | 5930-00-009-7511 (5930000097511) | |
| 5962-01-426-0084 (5962014260084) | 5935-00-900-9127 (5935009009127) | 5998-00-069-5683 (5998000695683) | 5930-00-472-3228 (5930004723228) | |
| 5945-00-701-1784 (5945007011784) | 5905-00-009-6425 (5905000096425) | 5961-01-381-7607 (5961013817607) | 5995-01-394-0372 (5995013940372) | |
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