| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-306-5562 (013065562) |
| NCB Code | USA (01) |
| Manufacturer | Nimikkeistokeskus Ncb Finland, Safran Usa Inc, Dla Land And Maritime, Honeywell International Inc, Atmel Corporation, Seeq Technology Inc, Xicor Inc |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| 10133848 | nimikkeistokeskus ncb finland | microcircuit memory | a486g | RFQ |
| 14521420-2 | safran usa inc | microcircuit memory | f6151 | RFQ |
| 5962-8764903XX | dla land and maritime | microcircuit memory | 16236 | RFQ |
| 5962-88525 | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8852503XA | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8852503XB | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 5962-8852503XX | dla land and maritime | microcircuit memory | 67268 | RFQ |
| 8502736-417 | honeywell international inc | microcircuit memory | 07187 | RFQ |
| 8764902XX | dla land and maritime | microcircuit memory | 16236 | RFQ |
| AT28C256 25DM 883 | atmel corporation | microcircuit memory | 1fn41 | RFQ |
| DM28C256-250 B | seeq technology inc | microcircuit memory | 61394 | RFQ |
| X28C256DMB-25 | xicor inc | microcircuit memory | 60395 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | 1270-01-142-2855 TARGET DESIGNAT |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 80.00 MILLIAMPERES NOMINAL TOTAL SUPPLY |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.25 VOLTS MAXIMUM TOTAL SUPPLY |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | EEPROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| Relevant Components for NSN - 5962-01-306-5562, 5962013065562 | ||||
| 5910-01-451-9053 (5910014519053) | 5905-01-283-2221 (5905012832221) | 5915-01-640-9526 (5915016409526) | 5905-00-107-3319 (5905001073319) | |
| 5962-01-236-5871 (5962012365871) | 5995-01-228-7197 (5995012287197) | 5995-01-619-3330 (5995016193330) | 5925-00-975-7105 (5925009757105) | |
| 5977-00-391-6223 (5977003916223) | 5935-01-085-9065 (5935010859065) | 5930-01-548-2521 (5930015482521) | 5985-01-068-4667 (5985010684667) | |
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