HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND MONOLITHIC AND W/ENABLE
CQSJ
INCLOSURE MATERIAL
CERAMIC
CQSZ
INCLOSURE CONFIGURATION
DUAL-IN-LINE
CQWX
OUTPUT LOGIC FORM
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
CQZP
INPUT CIRCUIT PATTERN
10 INPUT
CSSL
DESIGN FUNCTION AND QUANTITY
8 BUFFER,TRI-STATE
CTFT
CASE OUTLINE SOURCE AND DESIGNATOR
D-8 MIL-M-38510
CTQX
CURRENT RATING PER CHARACTERISTIC
160.00 MICROAMPERES MAXIMUM INPUT DRIVE
CWSG
TERMINAL SURFACE TREATMENT
SOLDER
CZEN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM PAC IDENTIFICATION OUTPUT
CZEQ
TIME RATING PER CHACTERISTIC
42.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 42.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT
TEST
TEST DATA DOCUMENT
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.).
TTQY
TERMINAL TYPE AND QUANTITY
20 PRINTED CIRCUIT
Relevant Components for NSN - 5962-01-265-8173, 5962012658173
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