HERMETICALLY SEALED AND BURN IN AND W/CLEAR AND W/CLOCK AND W/PRESET
CQSJ
INCLOSURE MATERIAL
CERAMIC
CQSZ
INCLOSURE CONFIGURATION
DUAL-IN-LINE
CQWX
OUTPUT LOGIC FORM
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
CQZP
INPUT CIRCUIT PATTERN
DUAL 4 INPUT
CSSL
DESIGN FUNCTION AND QUANTITY
2 FLIP-FLOP,D-TYPE,CLOCKED
CTFT
CASE OUTLINE SOURCE AND DESIGNATOR
D-1 MIL-M-38510
CTQX
CURRENT RATING PER CHARACTERISTIC
-25.00 MILLIAMPERES MINIMUM OUTPUT SINK AND 25.00 MILLIAMPERES MAXIMUM OUTPUT SINK
CWSG
TERMINAL SURFACE TREATMENT
SOLDER
CZEN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC
2.0 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE
FEAT
SPECIAL FEATURES
NUCLEAR HARDNESS CRITICAL ITEMS
TEST
TEST DATA DOCUMENT
14933-84056 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWIN
TTQY
TERMINAL TYPE AND QUANTITY
14 PRINTED CIRCUIT
Relevant Components for NSN - 5962-01-228-8376, 5962012288376
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